Product Name: Ni2Si Nickel Monosilicide 
Specification: 0.8-10um (D50) 
Appearance: Irregular 
Color: Black Grey 
Features: high melting point, good chemical stability 
Usage: In fields such as batteries, catalysts, optoelectronic devices, and materials science

Chemical formula: Ni2Si 

Molecular weight: 145.472 
CAS number: 12059-14-2 
MDL Number: MFCD00151367 
EINECS number: 235-033-1 
Density: 7.4g/cm3 
Melting point: 1255 ℃ 
Temperature coefficient of resistance (20-100 ° C) 689x10 negative 6th power/k 
Thermal expansion coefficient (20-100 ° C) 17x10 negative 6th power/k 
Thermal conductivity (100 ° C) 27xwm negative 1st power K negative 1st power 
Properties: Nickel silicide rapidly dissolves in hydrofluoric acid, slowly dissolves in hydrochloric acid, and is insoluble in water. Nickel silicide reacts fiercely with fluorine at room temperature, reaching white heat, and reacts with chlorine gas at red heat. Nickel silicide decomposes upon contact with aqua regia. 
Method: Silicon oxide, nickel (II) oxide, and aluminum can be obtained by heating them in a blast furnace. 
Application: Nickel silicon is an austenitic (NiSi) alloy; The material used as the negative terminal for N-type thermocouples. It has good thermoelectric stability above 1000 degrees Celsius and better antioxidant performance than E, J, and K-type electric couples. Nickel silicide is a type of intermetallic nickel silicon compound. Nickel silicides are important in microelectronics technology because they form at nickel silicon junctions. Thin layers of nickel silicide can also be used to improve the surface resistance of nickel alloys. 
Nickel silicide is a promising substitute material for silicides due to its low electrical resistivity, low silicon consumption, and lower formation temperature. Nickel silicide has recently become an ideal electrical contact material for the source, drain, and gate of complementary metal oxide silicon devices, and has shown good shrinkage performance. Nickel silicide is important in microelectronic devices because they are good conductors, and the conductivity of NiSi is similar to that of elemental nickel. When nickel reacts with silicon carbide as a semiconductor at high temperatures, nickel silicide and carbon are formed. Due to its corrosion resistance, oxidation resistance, and wear resistance, nickel silicide has the potential to serve as a coating for nickel based high-temperature alloys and stainless steel. The application of NiSi as an unsaturated hydrocarbon hydrogenation catalyst was studied. Silicon dioxide supported nickel silicide nanoparticles have been proposed as a widely used alternative catalyst for spontaneous combustion of Raney nickel. 
Packaging and storage: This product is packaged in an inert gas filled plastic bag, sealed and stored in a dry and cool environment. It should not be exposed to air to prevent moisture from causing oxidation and aggregation, which may affect dispersion performance and usage effectiveness; The packaging quantity can be provided according to customer requirements and divided into smaller packages.